3D IC Stacking Technology

The latest advances in three-dimensional integrated circuit stacking technology

With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.

3D IC Stacking Technology covers:

• High density through silicon stacking (TSS) technology



• Practical design ecosystem for heterogeneous 3D IC products



• Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack



• Process integration for TSV manufacturing



• High-aspect-ratio silicon etch for TSV



• Dielectric deposition for TSV



• Barrier and seed deposition



• Copper electrodeposition for TSV



• Chemical mechanical polishing for TSV applications



• Temporary and permanent bonding



• Assembly and test aspects of TSV technology