Atomically Precise Metal Clusters
Thorough discussion on how surface modification and self-assembly play roles in the atomically precise formation and property tailoring of molecular clusters
Atomically Precise Metal Clusters: Surface Engineering and Hierarchical Assembly summarizes and discusses the surface modification, assembly, and property tailoring of a wide variety of nanoclusters, including the well-explored metal clusters, addressing the structure-property relationships throughout. The atomic-level control in synthesis, new types of structures, and physical/chemical properties of nanoclusters are illustrated in various chapters.
The controlled modification and assembly of metal nanoclusters is expected to have a major impact on future nanoscience research and other areas, with distinctive metal cluster-based function materials with precise structures uncovering exciting opportunities in both fundamental research and practical applications.
Written by a highly qualified academic with significant research experience in the field, Atomically Precise Metal Clusters includes information on:
- Ligand engineering and assembly of coinage metal nanoclusters such as gold, silver, and copper
- Recent advances in post-modification of polyoxometalates and small transition metal chalcogenide superatom clusters
- Synthesis and assembly of cadmium chalcogenide supertetrahedral clusters and modification and assembly of Fe-S clusters
- Indium phosphide magic-sized clusters, ligand-tailoring platinum and palladium clusters, and metal oxo clusters (MOCs)
- Enabling access to desired functions in metal clusters for catalysis, optics, biomedicine, and other fields through surface engineering and supramolecular assembly
A timely and comprehensive book that summarizes the recent progress in the surface modification and self-assembly of metal nanoclusters, Atomically Precise Metal Clusters provides essential guidance for graduate students and advanced researchers in material science, chemistry, biomedicine, and other disciplines.
