Contact Angle, Wettability and Adhesion, Volume 2 - Kash L. Mittal

Contact Angle, Wettability and Adhesion, Volume 2

By: Kash L. Mittal (Editor)

Hardcover | 1 September 2002 | Edition Number 1

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This volume documents the proceedings of the Second International Symposium on Contact Angle, Wettability and Adhesion held in Newark, NJ, June 21-23, 2000. Since the first symposium, held in 1992, there had been tremendous research activity on many ramifications of wettability phenomena.
This volume contains a total of 33 papers, which were all properly peer reviewed, revised and edited before inclusion. Therefore, this book is not merely a collection of unreviewed manuscripts, but rather represents information which has passed peer scrutiny. Furthermore, the authors were asked to update their manuscripts, so the information contained in this book should be current and fresh.
The book is divided into three parts: 1) General Papers; 2) Contact Angle Measurements / Determination and Solid Surface Free Energy; and 3) Wetting and Spreading: Fundamental and Applied Aspects. The topics covered include: various factors influencing contact angle measurements; various ways to measure contact angles; contact angle hysteresis; microscopic studies of static and dynamic contact angles; monitoring surface properties by contact angle measurements; contact angle measurements on various materials (smooth, rough, porous, heterogeneous); microtensiometry to determine contact angles on individual particles; surface free energy determination of various polymeric materials via contact angle measurements; factors influencing wetting and spreading phenomena; dewetting kinetics; wetting properties of wood, coal, paper, human skin and optoelectronic materials; droplet deposition on fibers; electrowetting; and relation between wettability and adhesion.
This volume represents a commentary on the current R&D activity in this arena and it should aEUR" together with its predecessor (Volume 1) aEUR" be of great value and interest to anyone interested in this topic.

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