| Preface | p. iii |
| Introduction to EMI and the Electromagnetic Environment | p. 1 |
| Introduction to electromagnetic interference (EMI) | p. 1 |
| Introduction to electromagnetic interference regulations | p. 4 |
| Electromagnetic environment | p. 5 |
| References | p. 17 |
| Introduction to E and H, Near and Far Fields, Radiators, Receptors, and Antennas | p. 19 |
| Static and quasi-static fields | p. 20 |
| Electric waves on wires and in free space | p. 26 |
| Radiated power | p. 42 |
| Units of measurement | p. 45 |
| Receiving properties of an antenna | p. 46 |
| Simple, easily constructed E and H field antennas | p. 62 |
| Nonionizing electromagnetic field exposure safety limits | p. 75 |
| Computer programs | p. 84 |
| References | p. 93 |
| Typical Sources and Characteristics of Radiated and Conducted Emissions | p. 95 |
| Introduction to noise sources | p. 95 |
| Fourier transform methods and computer programs | p. 106 |
| Case Study 3.1: Noise levels generated by dc-to-dc converters | p. 107 |
| Transmitter-generated noise | p. 118 |
| References | p. 119 |
| Crosstalk and Electromagnetic Coupling Between PCB Tracks, Wires, and Cables | p. 121 |
| Introduction to crosstalk and electromagnetic coupling | p. 121 |
| Capacitive crosstalk and electric field coupling between wires and cables | p. 123 |
| Inductive crosstalk and magnetic field coupling between wires and cables | p. 131 |
| Combined inductive and capacitive crosstalk | p. 141 |
| References | p. 169 |
| Components, Emission Reduction Techniques, and Noise Immunity | p. 171 |
| Components | p. 171 |
| Emission reduction techniques | p. 228 |
| Noise immunity | p. 232 |
| Transient protection | p. 269 |
| Addresses of manufacturers mentioned in this Chapter | p. 281 |
| References | p. 282 |
| Electromagnetic Shielding | p. 283 |
| Reflection, absorption, and shielding effectiveness | p. 283 |
| Shielding effectiveness | p. 289 |
| New shielding materials: conductive paints and thermoplastics, plastic coatings, and glue | p. 297 |
| Seams, joints, ventilation, and other apertures | p. 304 |
| Gasketing theory, gasket transfer impedance, gasket type, and surface finish | p. 328 |
| Practical shielding and limitation on effectiveness | p. 348 |
| Compartmentalization | p. 349 |
| Shielding effectiveness of buildings | p. 349 |
| Computer program for evaluating shielding effectiveness | p. 352 |
| References | p. 354 |
| Cable Shielding, Coupling from E and H Fields, and Cable Emissions | p. 357 |
| Introduction to cable coupling and emissions | p. 357 |
| Cable shielding effectiveness/transfer impedance | p. 357 |
| Shield termination effects on transferred voltage | p. 385 |
| Coupling from E and H fields | p. 387 |
| Shield termination | p. 398 |
| Emissions from cables and wires | p. 403 |
| Reduction in the emissions of E and H fields from cables | p. 415 |
| Shielded connectors, backshells, and other shield termination techniques | p. 415 |
| Practical level of shielding required to meet MIL-STD/DO-160C or commercial radiated emission requirements | p. 426 |
| References | p. 430 |
| Grounding and Bonding | p. 433 |
| Introduction to grounding | p. 433 |
| Safety grounds, earth grounds, and large-system grounding | p. 434 |
| Signal ground and power ground | p. 443 |
| Guidelines for signal grounding | p. 453 |
| Power and grounding diagrams | p. 454 |
| Grounding for lightning protection | p. 454 |
| Bonding | p. 465 |
| References | p. 476 |
| EMI Measurements, Control Requirements, and Test Methods | p. 477 |
| Introduction | p. 477 |
| Test equipment | p. 478 |
| Diagnostic measurements | p. 495 |
| Commercial EMI requirements and measurement | p. 502 |
| Shielded rooms, anechoic chambers, transmission lines, and cell antennas | p. 567 |
| Military EMI requirements and measurement techniques | p. 589 |
| RTCA/DO-160 requirements | p. 635 |
| References | p. 638 |
| Systems EMC and Antenna Coupling | p. 639 |
| System-level EMC | p. 639 |
| Antenna-coupled EMI | p. 648 |
| Ambient site predictions and surveys | p. 671 |
| Case Study 10.3: Coupling into HV ac line from HF phased-array radar | p. 678 |
| References | p. 681 |
| Printed Circuit Boards | p. 683 |
| Introduction | p. 683 |
| Principles of radiation from printed circuit boards | p. 683 |
| Low-level radiation PCB layout | p. 685 |
| Comparison of logic types | p. 705 |
| Circuit-level reduction techniques | p. 710 |
| PCB grounding | p. 714 |
| Shielding a printed circuit board | p. 724 |
| PCB radiation, crosstalk prediction, and CAD programs | p. 729 |
| PCB layout case studies | p. 737 |
| Increased printed circuit board immunity | p. 746 |
| References | p. 747 |
| EMI and EMC Control, Case Studies, EMC Prediction Techniques, and Computational Electromagnetic Modeling | p. 749 |
| EMC control | p. 749 |
| EMI investigations | p. 753 |
| EMC predictions: general approach | p. 762 |
| EMC, computational electromagnetic modeling, and field solver computer programs | p. 786 |
| References | p. 812 |
| Characteristic Impedance of Conductors, Wires, and Cables | p. 813 |
| Units and Conversion Factors | p. 817 |
| Electric Field Strength to Magnetic Field to Power Density Conversions | p. 819 |
| Commonly Used Related Formulas | p. 821 |
| Data on Bare Solid Copper Wire (Dimensions, Weight, and Resistance) | p. 825 |
| Index | p. 827 |
| Table of Contents provided by Syndetics. All Rights Reserved. |
