Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
High Performance Compute and System-in-Package
By: Beth Keser, Steffen Krhnert
eBook | 7 December 2021
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ISBN: 9781119793892
ISBN-10: 1119793890
Series: IEEE Press
Published: 7th December 2021
Format: ePUB
Language: English
Publisher: Wiley
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- Non-FictionEngineering & TechnologyElectronics & Communications Engineering