Handbook of Advanced Plasma Processing Techniques

By: R. J. Shul, S. J. Pearton (Editor)

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Hardcover | 28 August 2000

At a Glance

Hardcover
672 Pages

Dimensions(cm)
23.39 x 15.6 x 3.66

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Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed "trial-and-error" approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved.

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You Can Find This Book In

Non-Fiction Engineering & Technology Mechanical Engineering & Materials Mechanical Engineering Materials Science Other Technologies & Applied Sciences Applied Optics Science Physics Materials & States of Matter Plasma Physics Quantum Physics & Quantum Mechanics & Quantum Field Theory

Atomic & Molecular Physics Technology in General Engineering in General Industrial Chemistry & Manufacturing Technologies Electronics & Communications Engineering Electronics Engineering Nuclear Physics

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Published: 1st November 2012

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