Introduction | p. 1 |
Strain Measurements at the Limit - The Moire Microscope | p. 3 |
Nonlinear analysis of interferometric moire fringes | p. 5 |
Microscopic moire interferometry | p. 18 |
Localized thermal strains in electronic interconnections by microscopic moire interferometry | p. 25 |
Titanium in elastic tension: micromechanical deformation | p. 34 |
Micromechanical thermal deformation of unidirectional boron/aluminum composite | p. 42 |
Fracture Mechanics | p. 49 |
Assessment of the shape of crack-tip plastic zones as a function of applied load | p. 51 |
Deformation around fatigue cracks from moire fringe measurement | p. 56 |
Applications of moire to cellulosic (paper and wood) and concrete materials | p. 66 |
Mixed-mode stress intensity factors in finite, edge-cracked orthotropic plates | p. 74 |
A hybrid experimental/computational approach to the assessment of crack growth criteria in composite laminates | p. 89 |
Experimental and computational assessment of the T fracture parameter during creep relaxation | p. 103 |
Moire interferometry and crack closure | p. 110 |
Electronic Packaging | p. 121 |
Determination of effective coefficients of thermal expansion (CTE) of electronic packaging components | p. 123 |
Determinations of thermal strains in solder joints: an application in electric packaging | p. 134 |
Thermomechanical behaviour of two-phase solder column connection under highly accelerated thermal cycle | p. 145 |
Verification of numerical models used in microelectronics product development | p. 153 |
Analysis of residual stresses in a die-attaching adhesive | p. 160 |
Characterization of thermomechanical behaviour of a flip-chip plastic ball grid array package assembly | p. 171 |
Complex Shapes | p. 177 |
Strain gauge verification by moire | p. 179 |
A high-precision calibration of electrical resistance strain gauges by moire interferometry | p. 185 |
Interlaminar deformation along the cylindrical surface of a hole in laminated composites | p. 195 |
Interlaminar deformation along the cylindrical surface of a hole in laminated composite tensile specimens | p. 207 |
Thick laminated composites in compression: free-edge effects on a ply-by-ply basis | p. 221 |
Loading effects in composite beam specimens | p. 230 |
Elastic-Plastic Hole Expansion | p. 237 |
Elastic-plastic hole expansion: an experimental and theoretical investigation | p. 239 |
Roller expansion of tubes in a tube-plate | p. 250 |
Hybrid Mechanics | p. 255 |
Some applications of high sensitivity moire interferometry | p. 257 |
Hybridizing moire with analytical and numerical techniques: differentiating moire measured displacements to obtain strains | p. 263 |
Residual Stresses | p. 269 |
Automated moire interferometry for residual stress determination in engineering objects | p. 271 |
Determination of thermal stresses near a bimaterial interface | p. 287 |
Interior strains by a hybrid 3d photoelasticity/moire interferometry technique | p. 294 |
High Temperature Effects and Thermal Strains | p. 297 |
Moire interferometry using grating photography and optical processing | p. 299 |
Heat-resistant gratings for moire interferometry | p. 311 |
Micromechanics and Contact Problems | p. 319 |
Grid method for damage analysis of ductile materials | p. 321 |
A contact problem | p. 342 |
Moire interferometry for measurement of strain near mechanical fasteners in composites | p. 361 |
Out-of-Plane Deformation, Flatness and Shape Measurement | p. 373 |
Shadow moire interferometry applied to composite column buckling | p. 375 |
Shadow moire interferometry with enhanced sensitivity by optical/digital fringe multiplication | p. 379 |
Shadow moire interferometry with a phase-stepping technique applied to thermal warpage measurement of modern electronic packages | p. 387 |
On-line system for measuring the flatness of large steel plates using projection moire | p. 397 |
Optical triangular profilometry: unified calibration | p. 408 |
Grating diffraction method | p. 417 |
Real Time and Dynamic Moire | p. 425 |
Real-time video moire topography | p. 427 |
Tensile impact delamination of a cross-ply interface studied by moire photography | p. 442 |
Real-time moire image processing | p. 455 |
Micro-scale strain measurement: limitations due to restrictions inherent in optical systems and phase-stepping routines | p. 485 |
Index | p. 499 |
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