| Preface | |
| Fundamentals | p. 1 |
| Frequency and Time | p. 1 |
| Time and Distance | p. 6 |
| Lumped Versus Distributed Systems | p. 7 |
| A Note About 3 dB and RMS Frequencies | p. 8 |
| Four Kinds of Reactance | p. 10 |
| Ordinary Capacitance | p. 11 |
| Ordinary Inductance | p. 17 |
| A Better Method for Estimating Decay Time | p. 22 |
| Mutual Capacitance | p. 25 |
| Mutual Inductance | p. 29 |
| High-Speed Properties of Logic Gates | p. 37 |
| Historical Development of a Very Old Digital Technology | p. 37 |
| Power | p. 39 |
| Speed | p. 59 |
| Packaging | p. 66 |
| Measurement Techniques | p. 83 |
| Rise Time and Bandwidth of Oscilloscope Probes | p. 83 |
| Self-inductance of a Probe Group Loop | p. 86 |
| Spurious Signal Pickup from Probe Ground Loops | p. 92 |
| How Probes Load Down a Circuit | p. 95 |
| Special Probing Fixtures | p. 98 |
| Avoiding Pickup from Probe Shield Currents | p. 104 |
| Viewing a Serial Data Transmission System | p. 108 |
| Slowing Down the System Clock | p. 110 |
| Observing Crosstalk | p. 111 |
| Measuring Operating Margins | p. 113 |
| Observing Metastable States | p. 120 |
| Transmission Lines | p. 133 |
| Shortcomings of Ordinary Point-to-Point Wiring | p. 133 |
| Infinite Uniform Transmission Line | p. 140 |
| Effects of Source and Load Impedance | p. 160 |
| Special Transmission Line Cases | p. 167 |
| Line Impedance and Propagation Delay | p. 178 |
| Ground Planes and Layer Stacking | p. 189 |
| High-Speed Current Follows the Path of Least Inductance | p. 189 |
| Crosstalk in Solid Ground Planes | p. 191 |
| Crosstalk in Slotted Ground Planes | p. 194 |
| Crosstalk in Cross-Hatched Ground Planes | p. 197 |
| Crosstalk with Power and Ground Fingers | p. 199 |
| Guard Traces | p. 201 |
| Near-End and Far-End Crosstalk | p. 204 |
| How to Stack Printed Circuit Board Layers | p. 212 |
| Terminations | p. 223 |
| End Terminators | p. 223 |
| Source Terminators | p. 231 |
| Middle Terminators | p. 235 |
| AC Biasing for End Terminators | p. 236 |
| Resistor Selection | p. 239 |
| Crosstalk in Terminators | p. 244 |
| Vias | p. 249 |
| Mechanical Properties of Vias | p. 249 |
| Capacitance of Vias | p. 257 |
| Inductance of Vias | p. 258 |
| Return Current and Its Relation to Vias | p. 260 |
| Power Systems | p. 263 |
| Providing a Stable Voltage Reference | p. 263 |
| Distributing Uniform Voltage | p. 268 |
| Everyday Distribution Problems | p. 279 |
| Choosing a Bypass Capacitor | p. 281 |
| Connectors | p. 295 |
| Mutual Inductance - How Connectors Create Crosstalk | p. 295 |
| Series Inductance - How Connectors Create EMI | p. 300 |
| Parasitic Capacitance - Using Connectors on a Multidrop Bus | p. 305 |
| Measuring Coupling in a Connector | p. 309 |
| Continuity of Ground Underneath a Connector | p. 312 |
| Fixing EMI Problems with External Connections | p. 314 |
| Special Connectors for High-Speed Applications | p. 316 |
| Differential Signaling Through a Connector | p. 319 |
| Power Handling Features of Connectors | p. 321 |
| Ribbon Cables | p. 323 |
| Ribbon Cable Signal Propagation | p. 324 |
| Ribbon Cable Crosstalk | p. 329 |
| Ribbon Cable Connectors | p. 336 |
| Ribbon Cable EMI | p. 338 |
| Clock Distribution | p. 341 |
| Timing Margin | p. 341 |
| Clock Skew | p. 343 |
| Using Low-Impedance Drivers | p. 346 |
| Using Low-Impedance Clock Distribution Lines | p. 348 |
| Source Termination of Multiple Clock Lines | p. 350 |
| Controlling Crosstalk on Clock Lines | p. 352 |
| Delay Adjustments | p. 353 |
| Differential Distribution | p. 360 |
| Clock Signal Duty Cycle | p. 361 |
| Canceling Parasitic Capacitance of a Clock Repeater | p. 362 |
| Decoupling Clock Receivers from the Clock Bus | p. 364 |
| Clock Oscillators | p. 367 |
| Using Canned Clock Oscillators | p. 367 |
| Clock Jitter | p. 376 |
| Collected References | p. 385 |
| A Points to Remember | p. 389 |
| B Calculation of Rise Time | p. 399 |
| C MathCad Formulas | p. 409 |
| Index | p. 441 |
| Table of Contents provided by Blackwell. All Rights Reserved. |
