
High Speed Signal Propagation
Advanced Black Magic
By: Howard Johnson
Hardcover | 24 February 2003 | Edition Number 1
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808 Pages
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Preface | p. xxi |
Glossary of Symbols | p. xxvii |
Fundamentals | p. 1 |
Impedance of Linear, Time-Invariant, Lumped-Element Circuits | p. 1 |
Power Ratios | p. 2 |
Rules of Scaling | p. 5 |
Scaling of Physical Size | p. 6 |
Power Scaling | p. 9 |
Time Scaling | p. 10 |
Impedance Scaling with Constant Voltage | p. 12 |
Dielectric-Constant Scaling | p. 14 |
Magnetic Permeability Scaling | p. 15 |
The Concept of Resonance | p. 16 |
Extra for Experts: Maximal Linear System Response to a Digital Input | p. 22 |
Transmission Line Parameters | p. 29 |
Telegrapher's Equations | p. 31 |
So Good It Works on Barbed Wire | p. 34 |
The No-Storage Principle and Its Implications for Returning Signal Current | p. 35 |
Derivation of Telegrapher's Equations | p. 38 |
Definition of Characteristic Impedance ZC | p. 39 |
Changes in Characteristic Impedance | p. 40 |
Calculation of Impedance Zc From Parameters R, L, G, And C | p. 41 |
Definition of Propagation Coefficient [gamma] | p. 44 |
Calculation of Propagation Coefficient [gamma] from Parameters R, L, G, and C | p. 46 |
Ideal Transmission Line | p. 48 |
DC Resistance | p. 55 |
DC Conductance | p. 57 |
Skin Effect | p. 58 |
What Causes the Skin Effect, and What Does It Have to Do With Skin? | p. 58 |
Eddy Currents within a Conductor | p. 61 |
High and Low-Frequency Approximations for Series Resistance | p. 63 |
Skin-Effect Inductance | p. 66 |
Modeling Internal Impedance | p. 67 |
Practical Modeling of Internal Impedance | p. 70 |
Special Issues Concerning Rectangular Conductors | p. 73 |
Concentric-Ring Skin-Effect Model | p. 75 |
Modeling Skin Effect | p. 76 |
Regarding Modeling Skin Effect | p. 79 |
Proximity Effect | p. 79 |
Proximity Factor | p. 81 |
Proximity Effect for Coaxial Cables | p. 84 |
Proximity Effect for Microstrip and Stripline Circuits | p. 85 |
Last Words on Proximity Effect | p. 85 |
Surface Roughness | p. 90 |
Severity of Surface Roughness | p. 90 |
Onset of Roughness Effect | p. 91 |
Roughness of PCB Materials | p. 91 |
Controlling Roughness | p. 92 |
Dielectric Effects | p. 94 |
Dielectric Loss Tangent | p. 98 |
Rule of Mixtures | p. 99 |
Calculating the Loss Tangent for a Uniform Dielectric Mixture | p. 101 |
Calculating the Loss Tangent When You Don't Know q | p. 103 |
Causality and the Network Function Relations | p. 105 |
Finding [vertical bar]er[vertical bar] to Match a Measured Loss Tangent | p. 110 |
Kramers-Kronig Relations | p. 114 |
Complex Magnetic Permeability | p. 115 |
Impedance in Series with the Return Path | p. 115 |
Slow-Wave Mode On-Chip | p. 117 |
Performance Regions | p. 121 |
Signal Propagation Model | p. 121 |
Extracting Parameters for RLGC Simulators | p. 127 |
Hierarchy of Regions | p. 128 |
A Transmission Line Is Always a Transmission Line | p. 130 |
Necessary Mathematics: Input Impedance and Transfer Function | p. 132 |
Lumped-Element Region | p. 135 |
Boundary of Lumped-Element Region | p. 136 |
Pi Model | p. 137 |
Taylor-Series Approximation of H (Lumped-Element Region) | p. 139 |
Input impedance (Lumped-Element Region) | p. 140 |
Transfer Function (Lumped-Element Region) | p. 143 |
Step Response (Lumped-Element Region) | p. 145 |
RC Region | p. 148 |
Boundary of RC Region | p. 149 |
Input Impedance (RC Region) | p. 151 |
Characteristic Impedance (RC Region) | p. 152 |
General Behavior within RC Region | p. 153 |
Propagation Coefficient (RC Region) | p. 155 |
Transfer Function (RC Region) | p. 155 |
Normalized Step Response (RC Region) | p. 157 |
Tradeoffs Between Distance and Speed (RC Region) | p. 159 |
Closed-Form Solution for Step Response (RC Region) | p. 159 |
Elmore Delay Estimation (RC Region) | p. 160 |
LC Region (Constant-Loss Region) | p. 166 |
Boundary of LC Region | p. 166 |
Characteristic Impedance (LC Region) | p. 167 |
Influence of Series Resistance on TDR Measurements | p. 169 |
Propagation Coefficient (LC Region) | p. 173 |
Possibility of Severe Resonance within the LC Region | p. 176 |
Terminating an LC Transmission Line | p. 179 |
Tradeoffs Between Distance And Speed (LC Region) | p. 183 |
Mixed-Mode Operation (LC and RC Regions) | p. 184 |
Skin-Effect Region | p. 185 |
Boundary of Skin-Effect Region | p. 185 |
Characteristic Impedance (Skin-Effect Region) | p. 186 |
Influence of Skin-Effect on TDR Measurement | p. 188 |
Propagation Coefficient (Skin-Effect Region) | p. 189 |
Possibility of Severe Resonance within Skin-Effect Region | p. 193 |
Step Response (Skin-Effect Region) | p. 195 |
Tradeoffs Between Distance and Speed (Skin-Effect Region) | p. 199 |
Dielectric Loss Region | p. 200 |
Boundary of Dielectric-Loss-Limited Region | p. 200 |
Characteristic Impedance (Dielectric-Loss-Limited Region) | p. 202 |
Influence of Dielectric Loss on TDR Measurement | p. 205 |
Propagation Coefficient (Dielectric-Loss-Limited Region) | p. 206 |
Possibility of Severe Resonance within Dielectric-Loss Limited Region | p. 210 |
Step Response (Dielectric-Loss-Limited Region) | p. 212 |
Tradeoffs Between Distance and Speed (Dielectric-Loss Region) | p. 216 |
Waveguide Dispersion Region | p. 216 |
Boundary of Waveguide-Dispersion Region | p. 217 |
Summary of Breakpoints Between Regions | p. 218 |
Equivalence Principle for Transmission Media | p. 221 |
Scaling Copper Transmission Media | p. 224 |
Scaling Multimode Fiber-Optic Cables | p. 229 |
Linear Equalization: Long Backplane Trace Example | p. 230 |
Adaptive Equalization: Accelerant Networks Transceiver | p. 234 |
Frequency-Domain Modeling | p. 237 |
Going Nonlinear | p. 237 |
Approximations to the Fourier Transform | p. 239 |
Discrete Time Mapping | p. 241 |
Other Limitations of the FFT | p. 243 |
Normalizing the Output of an FFT Routine | p. 243 |
Deriving the DFT Normalization Factors | p. 244 |
Useful Fourier Transform-Pairs | p. 245 |
Effect of Inadequate Sampling Rate | p. 247 |
Implementation of Frequency-Domain Simulation | p. 249 |
Embellishments | p. 251 |
What if a Large Bulk-Transport Delay Causes the Waveform to Slide Off the end of the Time-Domain Window? | p. 251 |
How Do I Transform an Arbitrary Data Sequence? | p. 251 |
How Do I Shift the Time-Domain Waveforms? | p. 252 |
What If I Want to Model a More Complicated System? | p. 252 |
What About Differential Modeling? | p. 252 |
Checking the Output of Your FFT Routine | p. 253 |
Pcb (printed-circuit board) Traces | p. 255 |
Pcb Signal Propagation | p. 257 |
Characteristic Impedance and Delay | p. 257 |
Resistive Effects | p. 258 |
Dielectric Effects | p. 268 |
Mixtures of Skin Effect and Dielectric Loss | p. 281 |
Non-TEM Modes | p. 282 |
Limits to Attainable Distance | p. 288 |
SONET Data Coding | p. 291 |
Pcb Noise and Interference | p. 294 |
Pcb: Reflections | p. 294 |
Pcb Crosstalk | p. 318 |
Pcb Connectors | p. 326 |
Mutual Understanding | p. 326 |
Through-Hole Clearances | p. 328 |
Measuring Connectors | p. 330 |
Tapered Transitions | p. 332 |
Straddle-Mount Connectors | p. 335 |
Cable Shield Grounding | p. 336 |
Modeling Vias | p. 338 |
Incremental Parameters of a Via | p. 338 |
Three Models for a Via | p. 341 |
Dangling Vias | p. 343 |
Capacitance Data | p. 345 |
Inductance Data | p. 351 |
The Future of On-Chip Interconnections | p. 359 |
Differential Signaling | p. 363 |
Single-Ended Circuits | p. 363 |
Two-Wire Circuits | p. 368 |
Differential Signaling | p. 370 |
Differential and Common-Mode Voltages and Currents | p. 374 |
Differential and Common-Mode velocity | p. 376 |
Common-Mode Balance | p. 377 |
Common-Mode Range | p. 378 |
Differential to Common-Mode Conversion | p. 378 |
Differential Impedance | p. 380 |
Relation Between Odd-Mode and Uncoupled Impedance | p. 383 |
Why the Odd-Mode Impedance Is Always Less Than the Uncoupled Impedance | p. 383 |
Differential Reflections | p. 384 |
Pcb Configurations | p. 385 |
Differential (Microstrip) Trace Impedance | p. 386 |
Edge-Coupled Stripline | p. 389 |
Breaking Up a Pair | p. 397 |
Broadside-Coupled Stripline | p. 399 |
PCB Applications | p. 404 |
Matching to an External, Balanced Differential Transmission Medium | p. 404 |
Defeating ground bounce | p. 405 |
Reducing EMI with Differential Signaling | p. 405 |
Punching Through a Noisy Connector | p. 407 |
Reducing Clock Skew | p. 409 |
Reducing Local Crosstalk | p. 411 |
A Good Reference about Transmission Lines | p. 413 |
Differential Clocks | p. 413 |
Differential Termination | p. 414 |
Differential U-Turn | p. 417 |
Your Layout Is Skewed | p. 419 |
Buying Time | p. 420 |
Intercabinet Applications | p. 422 |
Ribbon-Style Twisted-Pair Cables | p. 423 |
Immunity to Large Ground Shifts | p. 424 |
Rejection of External Radio-Frequency Interference (RFI) | p. 426 |
Differential Receivers Have Superior Tolerance to Skin Effect and Other High-Frequency Losses | p. 427 |
LVDS Signaling | p. 429 |
Output Levels | p. 429 |
Common-Mode Output | p. 430 |
Common-Mode Noise Tolerance | p. 430 |
Differential-Mode Noise Tolerance | p. 431 |
Hysteresis | p. 431 |
Impedance Control | p. 432 |
Trace Radiation | p. 435 |
Risetime | p. 435 |
Input Capacitance | p. 435 |
Skew | p. 435 |
Fail-Safe | p. 436 |
Generic Building-Cabling Standards | p. 439 |
Generic Cabling Architecture | p. 442 |
SNR Budgeting | p. 446 |
Glossary of Cabling Terms | p. 446 |
Preferred Cable Combinations | p. 449 |
FAQ: Building-Cabling Practices | p. 449 |
Crossover Wiring | p. 451 |
Plenum-Rated Cables | p. 452 |
Laying cables in an Uncooled Attic Space | p. 453 |
FAQ: Older Cable Types | p. 453 |
100-Ohm Balanced Twisted-Pair Cabling | p. 457 |
UTP Signal Propagation | p. 459 |
UTP Modeling | p. 460 |
Adapting the Metallic-Transmission Model | p. 462 |
UTP Transmission Example: 10BASE-T | p. 465 |
UTP Noise and Interference | p. 471 |
UTP: Far-End Reflections | p. 471 |
UTP: Near-End Reflections | p. 475 |
UTP: Hybrid Circuits | p. 481 |
UTP: Near-End Crosstalk | p. 487 |
UTP: Alien crosstalk | p. 490 |
UTP: Far-End Crosstalk | p. 490 |
Power sum NEXT and ELFEXT | p. 493 |
UTP: Radio-Frequency Interference | p. 493 |
UTP: Radiation | p. 496 |
UTP Connectors | p. 497 |
Issues with Screening | p. 501 |
Category-3 UTP at Elevated Temperature | p. 502 |
150-Ohm STP-A Cabling | p. 505 |
150-[Omega] STP-A Signal Propagation | p. 506 |
150-[Omega] STP-A Noise and Interference | p. 506 |
150-[Omega] STP-A: Skew | p. 507 |
150-[Omega] STP-A: Radiation and Safety | p. 508 |
150-[Omega] STP-A: Comparison with UTP | p. 509 |
150-[Omega] STP-A Connectors | p. 509 |
Coaxial Cabling | p. 513 |
Coaxial Signal Propagation | p. 515 |
Stranded Center-Conductors | p. 522 |
Why 50 Ohms? | p. 523 |
50-Ohm Mailbag | p. 526 |
Coaxial Cable Noise and Interference | p. 528 |
Coax: Far-End Reflected Noise | p. 528 |
Coax: Radio Frequency Interference | p. 529 |
Coax: Radiation | p. 529 |
Coaxial Cable: Safety Issues | p. 530 |
Coaxial Cable Connectors | p. 532 |
Fiber-Optic Cabling | p. 537 |
Making Glass Fiber | p. 538 |
Finished Core Specifications | p. 539 |
Cabling the Fiber | p. 541 |
Wavelengths of Operation | p. 543 |
Multimode Glass Fiber-Optic Cabling | p. 544 |
Multimode Signal Propagation | p. 546 |
Why Is Graded-Index Fiber Better than Step-Index? | p. 551 |
Standards for Multimode Fiber | p. 552 |
What Considerations Govern the Use of 50-micron Fiber? | p. 554 |
Multimode Optical Performance Budget | p. 555 |
Jitter | p. 568 |
Multimode Fiber-Optic Noise and Interference | p. 570 |
Multimode Fiber Safety | p. 571 |
Multimode Fiber with Laser Source | p. 571 |
VCSEL Diodes | p. 573 |
Multimode Fiber-Optic Connectors | p. 575 |
Single-Mode Fiber-Optic Cabling | p. 576 |
Single-Mode Signal Propagation | p. 577 |
Single-Mode Fiber-Optic Noise and Interference | p. 578 |
Single-Mode Fiber Safety | p. 578 |
Single-Mode Fiber-Optic Connectors | p. 578 |
Clock Distribution | p. 579 |
Extra Fries, Please | p. 582 |
Arithmetic of Clock Skew | p. 584 |
Clock Repeaters | p. 589 |
Active Skew Correction | p. 593 |
Zero-Delay Clock Repeaters | p. 594 |
Compensating for Line Length | p. 595 |
Stripline vs. Microstrip Delay | p. 596 |
Importance of Terminating Clock Lines | p. 599 |
Effect of Clock Receiver Thresholds | p. 601 |
Effect of Split Termination | p. 602 |
Intentional Delay Adjustments | p. 605 |
Fixed Delay | p. 605 |
Adjustable Delays | p. 607 |
Automatically Programmable Delays | p. 609 |
Serpentine Delays | p. 610 |
Switchback Coupling | p. 612 |
Driving Multiple Loads with Source Termination | p. 616 |
To Tee or Not To Tee | p. 619 |
Driving Two Loads | p. 625 |
Daisy-Chain Clock Distribution | p. 627 |
Case Study of Daisy-Chained Clock | p. 629 |
The Jitters | p. 634 |
When Clock Jitter Matters | p. 636 |
Measuring Clock Jitter | p. 648 |
Power Supply Filtering for Clock Sources, Repeaters, and PLL Circuits | p. 656 |
Healthy Power | p. 659 |
Clean Power | p. 661 |
Intentional Clock Modulation | p. 663 |
Signal Integrity Mailbag | p. 665 |
Jitter-Free Clocks | p. 667 |
Reduced-Voltage Signaling | p. 668 |
Controlling Crosstalk on Clock Lines | p. 669 |
Reducing Emissions | p. 670 |
Time-Domain Simulation Tools and Methods | p. 673 |
Ringing in a New Era | p. 673 |
Signal Integrity Simulation Process | p. 674 |
How Much Modeling Do You Need? | p. 676 |
What Happens After Parameter Extraction? | p. 676 |
A Word of Caution | p. 677 |
The Underlying Simulation Engine | p. 678 |
Evolving Forward | p. 680 |
Pitfalls of SPICE-Like Algorithms | p. 680 |
Transmission Lines | p. 682 |
Interpreting Your Results | p. 684 |
Using SPICE Intelligently | p. 685 |
IBIS (I/O Buffer Information Specification) | p. 685 |
What Is IBIS? | p. 686 |
Who Created IBIS? | p. 686 |
What Is Good About IBIS? | p. 687 |
What's Wrong with IBIS? | p. 687 |
What You Can Do to Help | p. 688 |
IBIS: History and Future Direction | p. 689 |
IBIS Historical Overview | p. 689 |
Comparison to SPICE | p. 690 |
Future Directions | p. 690 |
IBIS: Issues with Interpolation | p. 691 |
IBIS: Issues with SSO Noise | p. 695 |
Nature of EMC Work | p. 697 |
EMC Simulation | p. 698 |
Power and Ground Resonance | p. 699 |
Collected References | p. 703 |
Points to Remember | p. 710 |
Building a Signal Integrity Department | p. 731 |
Calculation of Loss Slope | p. 733 |
Two-Port Analysis | p. 735 |
Simple Cases Involving Transmission Lines | p. 737 |
Fully Configured Transmission Line | p. 739 |
Complicated Configurations | p. 741 |
Accuracy of Pi Model | p. 743 |
Pi-Model Operated in the LC Region | p. 745 |
erf() | p. 747 |
Index | p. 749 |
Table of Contents provided by Ingram. All Rights Reserved. |
ISBN: 9780130844088
ISBN-10: 013084408X
Series: Prentice Hall Modern Semiconductor Design
Published: 24th February 2003
Format: Hardcover
Language: English
Number of Pages: 808
Audience: College, Tertiary and University
Publisher: Pearson Education (US)
Country of Publication: US
Edition Number: 1
Dimensions (cm): 24.13 x 18.42 x 3.81
Weight (kg): 1.38
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