| Reinforcement Materials | p. 1 |
| Reinforcement Materials - Rigid | p. 1 |
| Glass | p. 1 |
| Glass Composition | p. 2 |
| D-Glass | p. 2 |
| E-Glass | p. 3 |
| S-Glass | p. 4 |
| Quartz | p. 4 |
| Glass Fiber Manufacturing | p. 5 |
| From Yarn to Fabric | p. 7 |
| Glass Types and Construction | p. 7 |
| Glass Fabric Weave | p. 9 |
| Plain Weave | p. 9 |
| Twill Weave | p. 9 |
| Long-Shaft Satin | p. 10 |
| Basket Weave | p. 10 |
| Leno Weave | p. 11 |
| Surfacing Mat, Paper, or Veil | p. 11 |
| Glass Fiber Paper | p. 12 |
| Quartz | p. 12 |
| Properties of Glass Fabrics | p. 13 |
| Moisture and Chemical Resistance | p. 13 |
| Electrical Properties | p. 13 |
| Heat and Fire Resistance | p. 14 |
| Thermal Conductivity | p. 14 |
| Aramids | p. 14 |
| Nonwoven Aramid (Thermount) | p. 14 |
| Constraining Dielectric Materials (Kevlar) | p. 16 |
| References | p. 19 |
| Resins | p. 21 |
| Introduction | p. 21 |
| Polyester Resin | p. 22 |
| Epoxy | p. 23 |
| Difunctional Epoxy | p. 24 |
| Multifunctional Epoxy | p. 25 |
| General-Purpose Systems Having a Tg between 135 and 145[degree]C | p. 26 |
| Higher-Performance Multifunctional Epoxies with a Tg between 150 and 165[degree]C | p. 26 |
| High-Temperature Multifunctional Epoxy with a Tg between 170 and 185[degree]C | p. 27 |
| Tetrafunctional Epoxy | p. 27 |
| Curing Agent | p. 27 |
| High-Tg Epoxy | p. 30 |
| Polyimide | p. 31 |
| Epoxy-Blended Polyimide | p. 32 |
| Cyanate Ester and Cyanate Ester Blends (BT Resin) | p. 33 |
| Cyanate Ester Resins | p. 33 |
| Polyphenylene Oxide (PPO) Epoxy Blends | p. 34 |
| Getek Resins | p. 35 |
| Polytetrafluoroethylene Resin (PTFE) | p. 35 |
| References | p. 37 |
| Flexible Films | p. 39 |
| Introduction | p. 39 |
| Types of Flexible Materials | p. 40 |
| Polyethylene Terephthalate ([PET] Polyester) | p. 40 |
| Polyester/Epoxy | p. 42 |
| Polyethylene Naphthalate (PEN) | p. 42 |
| Fluorocarbons (FEP) | p. 42 |
| Polyimide | p. 44 |
| Tear Resistance | p. 45 |
| Dimensional Stability | p. 45 |
| Aramid | p. 46 |
| Adhesives | p. 48 |
| Types and Use of Adhesive | p. 49 |
| Coating Process (Adhesive) | p. 50 |
| Major Adhesive Types | p. 50 |
| Adhesiveless Systems | p. 52 |
| Cast to Foil | p. 53 |
| Vapor Deposition on Film | p. 53 |
| Direct Vapor/Sputter Metallization onto Polyimide Film | p. 53 |
| Plated on Film | p. 54 |
| Adhesiveless Properties | p. 54 |
| Electrical Advantage | p. 54 |
| Mechanical Advantage | p. 55 |
| Thermal Advantage | p. 55 |
| Cover Coat/Cover Layer | p. 55 |
| Bond Plies | p. 57 |
| Conductive Materials | p. 57 |
| Electrodeposited Copper | p. 58 |
| Rolled Annealed Copper (RA) | p. 59 |
| Copper-Clad Laminates | p. 59 |
| References | p. 63 |
| Copper Foils | p. 65 |
| Introduction | p. 65 |
| Electrodeposited Copper Foil (also called ED foil) | p. 65 |
| Rolled Copper Foils (also called RA foil) | p. 67 |
| Fabricating Rolled Copper Foils | p. 67 |
| Foil Treatment | p. 69 |
| Heat Treatment | p. 69 |
| Foil Processing | p. 69 |
| Grades | p. 71 |
| Electrodeposited | p. 71 |
| Grade-1 or Standard Electrodeposited (STD-Type E) | p. 71 |
| Grade-2 or High-Ductility Electrodeposited Foils (HDE-Type E) | p. 71 |
| Grade-3 or High-Temperature Elongation Foil (HTE-Type E) | p. 72 |
| Grade-4 Annealed Electrodeposited or "Super High Duct" (ANN-Type E) | p. 73 |
| Rolled Copper Foil | p. 73 |
| Grade-5 "As Rolled" Wrought Copper (AR-Type W) | p. 73 |
| Grade-6 or Light Cold Rolled Wrought (LCR-Type W Special Temper) | p. 73 |
| Grade-7 or Rolled Annealed Wrought (ANN-Type W) | p. 74 |
| Grade-8 or "As Rolled" Wrought Low- Temperature Annealable (Type LTA) | p. 75 |
| Properties | p. 75 |
| Application | p. 75 |
| Nickel Foil | p. 75 |
| References | p. 76 |
| Laminates, Rigid | p. 77 |
| Introduction | p. 77 |
| NEMA Grades | p. 77 |
| Paper-Based Laminates | p. 77 |
| Types of Laminates | p. 78 |
| XPC | p. 78 |
| XXXPC | p. 79 |
| FR-1 | p. 79 |
| FR-2 | p. 79 |
| FR-3 | p. 80 |
| Properties, Construction, and Specifications (Paper-Based Laminates) | p. 80 |
| Processing Paper-Grade Laminates | p. 80 |
| Composite Laminates | p. 80 |
| Reinforcing Mats | p. 82 |
| Surfacing Mats, Paper, or Veil | p. 86 |
| Glass Fiber "Paper" | p. 86 |
| Polyester Glass Mat | p. 86 |
| Types of Composite Laminate | p. 87 |
| CEM-1 | p. 87 |
| CEM-3 | p. 87 |
| CRM-5 | p. 87 |
| FR-6 | p. 88 |
| Properties, Construction, and Specifications (Composite Laminates) | p. 88 |
| Storage | p. 88 |
| Material Recommendation | p. 92 |
| Rigid Laminates (Glass-Reinforced) | p. 92 |
| Electrical Characteristics | p. 94 |
| Laminate Thickness | p. 94 |
| Laminates, Rigid Glass Reinforcement | p. 95 |
| Epoxy Laminate (FR-4) | p. 95 |
| Difunctional Epoxies | p. 96 |
| Cyanate Ester | p. 98 |
| Polyimide Laminates | p. 100 |
| Polyimide/Glass | p. 100 |
| Polyimide Glass and Copper-Invar-Copper | p. 101 |
| Polyimide Quartz | p. 101 |
| Polyphenylene Oxide (PPO) | p. 102 |
| Aramid Laminates | p. 102 |
| Epoxy Thermount | p. 102 |
| Multifunctional Epoxy/Nonwoven Aramid Reinforcement | p. 104 |
| Epoxy on Woven Kevlar | p. 104 |
| Prepreg | p. 106 |
| Manufacturing Prepreg | p. 106 |
| Additive Laminates | p. 107 |
| Additive Circuitry | p. 107 |
| Semiadditive Laminates | p. 107 |
| Ultrathin Copper Foil Clad | p. 108 |
| Unclad | p. 108 |
| Unclad or Adhesive-Coated | p. 109 |
| Catalytic or Seeded | p. 109 |
| References | p. 110 |
| High-Speed/High-Frequency Laminates | p. 113 |
| Introduction | p. 113 |
| High-Speed/High-Frequency Laminates | p. 113 |
| RF Analog Circuit Characteristics | p. 114 |
| Digital Circuit Characteristics | p. 114 |
| Two Major Classes of Reinforcements | p. 114 |
| Goal of Each Application Area | p. 115 |
| Thin Laminates | p. 116 |
| Resins | p. 116 |
| Polytetrafluoroethylene Laminates | p. 116 |
| Ceramic-Filled Polytetrafluoroethylene | p. 120 |
| New Fluoropolymer Composite Materials | p. 120 |
| Epoxy Resin | p. 122 |
| High-Frequency Laminate Designations | p. 122 |
| GRN Type Laminates with Glass Microfibers | p. 122 |
| GRN Type Laminates with Nonwoven Fiberglass | p. 123 |
| GTN Type Laminates with E-Glass | p. 124 |
| Type GXN Laminates with E-Glass | p. 124 |
| GYN Type Laminates with E-Glass | p. 125 |
| High-Dk (6.0 to 10.5) Laminates with E-Glass | p. 126 |
| Temperature-Stable Dielectric Constant and Low-CTE Laminates with E-Glass | p. 127 |
| Commercial-Grade Laminates | p. 128 |
| Laminate Construction | p. 129 |
| Cross-Plied and Non-Cross-Plied Construction (meet type GT) | p. 129 |
| Bonding | p. 130 |
| Dimensional Stability | p. 130 |
| Drilling | p. 131 |
| References | p. 131 |
| Metal Core and Constraining Core Materials | p. 133 |
| Introduction | p. 133 |
| Copper-Invar-Copper (CIC) | p. 134 |
| Copper-Molybdenum-Copper (CMC) | p. 135 |
| Silicon Carbide-Reinforced Aluminum (SiC/Al) | p. 138 |
| Coefficient of Thermal Expansion Trade-Offs (CTE) | p. 140 |
| References | p. 141 |
| Abbreviations, Definitions, and Terms | p. 143 |
| Index | p. 153 |
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