Mems
A Practical Guide to Design, Analysis and Applications
By: Jan Korvink, Oliver Paul
Hardcover | 31 December 2006
At a Glance
990 Pages
23.37 x 16.36 x 4.27
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Industry Reviews
Foreword | p. xvii |
Preface | p. xix |
Microtransducer Operation | p. 1 |
Introduction | p. 1 |
Transduction | p. 2 |
Signal Domains | p. 2 |
Block Schematics of Transducers | p. 6 |
Transduction Effects | p. 12 |
Microsystem Performance | p. 13 |
Figures of Merit | p. 13 |
Sensitivity, Selectivity, and Offset | p. 18 |
Noise | p. 21 |
Transducer Operation Techniques | p. 26 |
Calibration | p. 26 |
Compensation | p. 28 |
Stabilization | p. 36 |
Multiple Measurements | p. 38 |
Circuitry | p. 42 |
Powering Microsystems | p. 44 |
Local Energy Storage | p. 44 |
Miniaturized Fuel Cells | p. 45 |
Optical and Electromagnetic Energy Transmission | p. 46 |
Energy Harvesting | p. 47 |
References | p. 48 |
Material Properties: Measurement and Data | p. 53 |
Introduction | p. 53 |
Measurement Methods | p. 55 |
Internal Stress ([sigma]) | p. 55 |
Young's Modulus (E) | p. 58 |
Poisson's Ratio | p. 61 |
Yield Strength and Fracture Strength | p. 62 |
Fracture Toughness | p. 68 |
Fatigue | p. 69 |
Thermal Conductivity and Specific Heat | p. 70 |
Data | p. 74 |
Si | p. 74 |
Poly-Si | p. 75 |
Metal | p. 82 |
Dielectrics | p. 84 |
References | p. 87 |
MEMS and NEMS Simulation | p. 93 |
Introduction | p. 93 |
Simulation Scenario | p. 93 |
Generic Organization of a Computational Tool | p. 101 |
Graphical User Interface or Front End | p. 101 |
Input Files and Parsing | p. 102 |
Preprocessing | p. 102 |
Solving | p. 103 |
Post-Processing and Program Interfacing | p. 109 |
Methods for Materials Simulation | p. 111 |
Computational Methods that Solve PDEs | p. 122 |
Design Automation Methods | p. 138 |
Case Studies | p. 159 |
Summary | p. 180 |
Acknowledgments | p. 182 |
References | p. 182 |
System-Level Simulation of Microsystems | p. 187 |
Introduction | p. 187 |
Behavioral Modeling of MEMS Components | p. 193 |
Micromechanical Plates | p. 193 |
Micromechanical Flexures | p. 195 |
Electrostatic Gaps | p. 199 |
Reduced-Order Modeling | p. 205 |
Formulation of Equations of Motion | p. 209 |
Structured Design Tools | p. 215 |
Signal-Flow Simulations | p. 216 |
Conservative Network Simulations | p. 216 |
Analog Hardware Description Languages | p. 218 |
A Structured MEMS Methodology | p. 220 |
Conclusions | p. 224 |
References | p. 224 |
Thermal-Based Microsensors | p. 229 |
Introduction | p. 229 |
Thermoresistors | p. 230 |
Metal Film Thermoresistors | p. 230 |
Semiconducting Thermoresistors | p. 232 |
Silicon Spreading Resistance Temperature Sensor | p. 234 |
Thermoresistors for the Detection of Thermal Radiation | p. 235 |
Pellistors | p. 238 |
Silicon Diodes and Transistors as Thermal Microsensors | p. 240 |
Thermoelectric Microsensors | p. 243 |
Microthermopiles as IR Radiation Detectors | p. 250 |
Thermopile Arrays | p. 251 |
Thermoelectric Vacuum Microsensors | p. 255 |
Gas Flow Microsensors | p. 257 |
AC/DC Thermoconverter | p. 258 |
Heat Flux Sensors | p. 259 |
Microelectromechanical Thermoelectric Cooler | p. 262 |
CMOS-Compatible Thermal-Based Microsensors and Microactuators | p. 266 |
Diagnostic Thermal-Based Microstructures | p. 273 |
Thermoelectric Microtips for AFM Temperature Sensors | p. 273 |
Diagnostic Microstructures for the Investigation of Thermal Properties of Thin Films | p. 275 |
Conclusion | p. 276 |
References | p. 276 |
Photon Detectors | p. 281 |
Introduction | p. 281 |
Detectors | p. 284 |
Mo/a-Si:H Schottky Diode X-Ray Image Sensors | p. 284 |
ITO/a-Si:H Schottky Diode Optical Image Sensors | p. 289 |
ITO/p-i-n Optical Image Sensors | p. 293 |
Thin-Film Transistors | p. 296 |
TFT Structures and Operation | p. 296 |
Threshold Voltage (VT) Metastability | p. 299 |
Pixel Integration | p. 308 |
Imaging Arrays | p. 314 |
Conventional Passive Pixel Sensor Arrays | p. 314 |
Amorphous Silicon Current-Mediated Active Pixel Sensor Arrays | p. 320 |
Amorphous Silicon Voltage-Mediated Active Pixel Sensor Arrays | p. 324 |
Integrated Amorphous Silicon Multiplexers for Imaging Arrays | p. 331 |
New Challenges in Large-Area Digital Imaging | p. 334 |
References | p. 338 |
Free-Space Optical MEMS | p. 345 |
Introduction | p. 345 |
General Discussion of Micromirror Scanners | p. 346 |
Electrostatic Scanners | p. 349 |
Scanners with Electrostatic Parallel-Plate Actuators | p. 351 |
Electrostatic Vertical Comb-Drive Scanners | p. 356 |
Scanning Mirrors with Magnetic and Electromagnetic Actuators | p. 361 |
Micromirror Arrays with Mirror Size [less than or equal] 100 Micrometers | p. 364 |
Micromirrors for Dynamic Spectral Equalizers | p. 370 |
2-D MEMS Optical Switches | p. 370 |
Switch Configuration, Requirements, and Expendability | p. 370 |
Vertical Chopper-Type Switch | p. 376 |
Switch with Pop-Up Mirrors | p. 380 |
2 x 2 Switches | p. 383 |
Optical Attenuator Array | p. 386 |
Tunable WDM Devices | p. 388 |
Tunable Filters | p. 388 |
Tunable Lasers and Detectors | p. 390 |
Diffractive Optical MEMS | p. 390 |
Summary | p. 394 |
Acknowledgment | p. 394 |
References | p. 394 |
Integrated Micro-Optics | p. 403 |
Introduction | p. 403 |
Definitions | p. 403 |
Components | p. 403 |
Summary | p. 404 |
Guided Waves | p. 405 |
Reflections at Boundaries | p. 405 |
Ray-Optic Model | p. 409 |
Modes and Propagation | p. 413 |
Electromagnetic Model | p. 416 |
Confinement Factor | p. 418 |
Solving a Waveguide | p. 420 |
Stripe Waveguides | p. 421 |
Stripe Waveguide Structures | p. 422 |
Stripe Waveguide Modeling | p. 426 |
Input/Output Coupling | p. 429 |
End-Fire Coupling | p. 430 |
Butt Coupling | p. 431 |
Numerical Aperture | p. 432 |
Tapers | p. 433 |
Waveguide Characterization | p. 434 |
Modes | p. 434 |
Losses | p. 435 |
Integrated Optical Devices | p. 438 |
Couplers | p. 438 |
Interferometers | p. 441 |
Active Optical Devices | p. 444 |
Materials | p. 445 |
Silicon | p. 446 |
GaAs | p. 446 |
Glass | p. 447 |
Plastics | p. 448 |
Applications | p. 448 |
Application Example: Monolithic Displacement Sensors | p. 448 |
References | p. 450 |
Microsensors for Magnetic Fields | p. 453 |
Introduction | p. 453 |
Magnetic Fields for Different Applications | p. 453 |
Methods for Sensing and Applications of Magnetic Fields | p. 454 |
(Micro) Sensors for a Magnetic Field | p. 456 |
Main Figures of Merit of Magnetic Microsensors | p. 457 |
Classification of Magnetic Sensors: Figures of Merit | p. 457 |
Characteristics Related to OUT(B)[subscript C] | p. 457 |
Characteristics Related to OUT(C)[subscript B] | p. 462 |
Characteristics Related to the SD | p. 463 |
Hall Microsensors | p. 463 |
The Lorentz Force | p. 463 |
Hall Effect | p. 464 |
Hall Effect as Sensor Action | p. 464 |
Hall Voltage Mode of Operation | p. 466 |
Hall Current Mode of Operation | p. 470 |
Diode Hall Effect | p. 471 |
Hall Effect Devices | p. 471 |
Magnetoresistors | p. 478 |
Physical Magnetoresistance Effect | p. 481 |
Geometrical Magnetoresistance Effect | p. 481 |
Semiconductor Magnetoresistors | p. 482 |
Spin-Dependent Magnetoresistance | p. 483 |
GMR Sensors | p. 484 |
Magnetodiodes | p. 484 |
Magnetoconcentration and Magnetodiode Effects | p. 484 |
Magnetodiode Microsensors | p. 485 |
Magnetotransistors and Related Microsensors | p. 488 |
General Approach to Bipolar Magnetotransistor Design | p. 488 |
Principles of BMT Operation | p. 490 |
BMT Microsensors | p. 491 |
Sensors Related to the BMTs | p. 494 |
Magnetic Field-based Functional Multisensors | p. 495 |
Functional Approach to Multisensors | p. 495 |
Linear Multisensors for Magnetic Field and Temperature | p. 495 |
Linear Multisensor for Magnetic Field, Temperature, and Light | p. 498 |
Functional Gradiometer Microsensors | p. 499 |
2-D and 3-D Vector Microsystems for Magnetic Fields | p. 500 |
Interfaces and Improvement of Characteristics of Magnetic Microsensors | p. 502 |
Biasing Circuits and Signal Processing Electronics | p. 502 |
Improvement of Magnetosensor Characteristics | p. 507 |
Magnetic Systems for Contactless Measurements | p. 512 |
Conclusions and Outlook | p. 514 |
References | p. 516 |
Mechanical Microsensors | p. 523 |
Introduction | p. 523 |
Automotive | p. 524 |
Computers and Peripherals | p. 525 |
Consumer Products | p. 525 |
Medical and Biological Applications | p. 526 |
Inertial Sensors | p. 527 |
Accelerometers | p. 528 |
Yaw-Rate Sensors | p. 539 |
Pressure Sensors | p. 550 |
Fundamentals | p. 550 |
Bulk-Micromachined Pressure Sensors | p. 551 |
Surface-Micromachined Pressure Sensors | p. 553 |
Signal Generation | p. 554 |
Force and Torque Sensors | p. 560 |
Linking the Macro World to the Micro World | p. 561 |
Fabrication, Protection, Test, and Calibration | p. 561 |
Conclusions | p. 563 |
References | p. 563 |
Semiconductor-Based Chemical Microsensors | p. 567 |
Introduction | p. 567 |
Thermodynamics of Chemical Sensing | p. 574 |
Chemomechanical Sensors | p. 580 |
Rayleigh SAW Devices | p. 583 |
Flexural-Plate-Wave or Lamb-Wave Devices | p. 586 |
Resonating Cantilevers | p. 589 |
Thermal Sensors | p. 591 |
Catalytic Thermal Sensors (Pellistors) | p. 592 |
Thermoelectric or Seebeck-effect Sensors | p. 595 |
Optical Sensors | p. 598 |
Integrated Optics | p. 603 |
Microspectrometers | p. 608 |
Bioluminescent Bioreporter Integrated Circuits | p. 611 |
Surface Plasmon Resonance Devices | p. 613 |
Electrochemical Sensors | p. 615 |
Voltammetric Sensors | p. 617 |
Potentiometric Sensors | p. 622 |
Conductometric Sensors | p. 636 |
Combinations of Electrochemical Principles | p. 646 |
Acknowledgments | p. 648 |
References | p. 648 |
Microfluidics | p. 667 |
Introduction | p. 667 |
Properties of Fluids | p. 670 |
Volumes and Length Scales | p. 670 |
Mixtures | p. 671 |
Physical Properties | p. 672 |
Vapor Pressure | p. 673 |
Surface Tension | p. 673 |
Electrical Properties | p. 674 |
Optical Properties | p. 674 |
Transport Phenomena | p. 675 |
Physics of Microfluidic Systems | p. 678 |
Navier-Stokes Equations | p. 678 |
Laminar Flow | p. 679 |
Dynamic Pressure | p. 680 |
Fluidic Networks | p. 682 |
Heat Transfer | p. 683 |
Interfacial Surface Tension | p. 685 |
Electrokinetics | p. 686 |
Fabrication Technologies | p. 689 |
Silicon | p. 690 |
Plastics | p. 692 |
Quartz | p. 694 |
Glass | p. 695 |
Flow Control | p. 696 |
Check Valves | p. 697 |
Capillary Breaks | p. 698 |
Active Microvalves | p. 699 |
Micropumps | p. 702 |
Microdisplacement Pumps | p. 702 |
Charge-Induced Pumping Mechanisms | p. 703 |
Other Pumping Mechanisms | p. 703 |
Sensors | p. 703 |
Flow Sensors | p. 704 |
Chemical Sensors | p. 706 |
Pipettes and Dispensers | p. 707 |
Pipettes | p. 707 |
Dispensers | p. 708 |
Microarrays | p. 709 |
Concept | p. 709 |
Fabrication | p. 710 |
Particle-Based Microarray Concepts | p. 712 |
Microreactors | p. 713 |
Micromixers | p. 713 |
Heat Exchangers | p. 714 |
Chemical Reactors | p. 715 |
Microanalytical Chips | p. 715 |
Lab-on-a-Chip Systems | p. 715 |
Chip-Based Capillary Electrophoresis | p. 716 |
References | p. 717 |
Biomedical Systems | p. 729 |
Introduction and Overview | p. 729 |
Materials and Fabrication Techniques | p. 730 |
Material Requirements | p. 730 |
Fabrication Techniques | p. 733 |
Surgical Systems | p. 735 |
Sensors | p. 738 |
Motion Control | p. 738 |
Microinstruments | p. 739 |
Tissue Repair | p. 739 |
Therapeutic Systems | p. 742 |
Implantable Delivery Systems | p. 743 |
Mechanical Delivery Systems | p. 744 |
Summary | p. 745 |
References | p. 746 |
Microactuators | p. 751 |
Introduction | p. 751 |
Actuators: Transducers with Mechanical Output | p. 752 |
Transduction Mechanisms | p. 752 |
Scaling Advantages and Issues | p. 753 |
Electrical Microactuators | p. 754 |
Electrostatic Forces | p. 755 |
Electrostatic Systems | p. 755 |
Forces in Electrostatic Systems | p. 759 |
Scaling Properties | p. 760 |
Electrostatic Microactuator Configurations | p. 765 |
Gap-Closing Electrostatic Microactuators | p. 766 |
Examples of Gap-Closing Electrostatic Microactuators | p. 770 |
Constant-Gap Electrostatic Microactuators | p. 778 |
Examples of Constant-Gap Electrostatic Microactuators | p. 780 |
Hybrid Electrostatic Microactuators | p. 785 |
Electrostatic Induction | p. 786 |
Issues and Challenges | p. 787 |
Piezoelectric Microactuators | p. 787 |
Piezoelectric Energy Density | p. 789 |
Piezoelectric Microactuator Configurations | p. 790 |
Piezoelectric Microactuator Design Issues | p. 795 |
Electrostriction, Electrets, and Electrorheological Fluids | p. 797 |
References | p. 797 |
Micromachining Technology | p. 805 |
Introduction | p. 805 |
Bulk Micromachining | p. 805 |
Wet Etching | p. 806 |
High-Aspect-Ratio Micromachining | p. 816 |
Surface Micromachining | p. 824 |
Basic Process Sequence | p. 824 |
Materials and Etching | p. 825 |
Epi-Micromachining | p. 829 |
SIMPLE | p. 829 |
SCREAM | p. 830 |
Black Silicon | p. 831 |
MELO | p. 832 |
Porous Silicon | p. 833 |
SIMOX | p. 834 |
Epi-Poly | p. 835 |
Release and Stiction | p. 836 |
IC Compatibility Issues | p. 837 |
Compatible Bulk Micromachining | p. 837 |
Compatible Surface Micromachining | p. 840 |
Compatible Epi-Micromachining | p. 844 |
Conclusions | p. 844 |
References | p. 845 |
LIGA Technology for R&D and Industrial Applications | p. 853 |
Introduction | p. 853 |
The LIGA Process | p. 854 |
Mask Making | p. 857 |
Deep X-Ray Lithography | p. 859 |
Electroplating and Micromolding | p. 862 |
Sacrificial Layer Technique | p. 865 |
UV-LIGA Based on UV Lithography | p. 867 |
Application in Modular Micro-Optical Systems | p. 867 |
Definition of a Modular Micro-Optical System | p. 867 |
Multifiber Connector from Polymer | p. 869 |
Heterodyne Receiver | p. 871 |
Spectrometer | p. 874 |
Distance Sensor | p. 874 |
Optical Cross-Connect with Rotating Mirrors | p. 876 |
Oscillating Modulator for Infrared Light | p. 876 |
Laser Scanner for Barcode Reading Actuated by Electromagnetics | p. 879 |
FTIR Spectrometer for Infrared Light | p. 881 |
Ultra-High X-Ray Lenses in SU8 | p. 884 |
Mechanical Applications | p. 885 |
Cycloid Gear System | p. 885 |
LIGA Gyroscope | p. 889 |
Microturbines for Cardiac Catheters | p. 891 |
Watch Pieces Made by UV-LIGA | p. 891 |
Outlook | p. 895 |
Acknowledgments | p. 896 |
References | p. 897 |
Interface Circuitry and Microsystems | p. 901 |
Introduction | p. 901 |
Microsensor Systems | p. 902 |
Microsensor System Applications | p. 905 |
Automotive Sensors | p. 907 |
Biomedical Sensors | p. 908 |
Sensors for Household Appliances, Building Control, and Industrial Control | p. 908 |
Environmental Sensors | p. 909 |
Interface Circuit Architecture | p. 909 |
Requirements and Specifications | p. 910 |
Analog Front-End | p. 912 |
Voltage Output | p. 912 |
Current or Charge Output | p. 916 |
Impedance Variation | p. 918 |
A/D Converter | p. 921 |
Digital Processing and Output Interface | p. 931 |
Digital Signal Processing | p. 931 |
Wired Output Interfaces | p. 931 |
Wireless Output Interfaces | p. 933 |
Conclusions | p. 934 |
References | p. 934 |
Contributors | p. 943 |
Index | p. 945 |
Table of Contents provided by Ingram. All Rights Reserved. |
ISBN: 9780815514978
ISBN-10: 0815514972
Series: Microelectromechanical Systems
Published: 31st December 2006
Format: Hardcover
Language: English
Number of Pages: 990
Audience: Professional and Scholarly
Publisher: WILLIAM ANDREW INC
Country of Publication: US
Dimensions (cm): 23.37 x 16.36 x 4.27
Weight (kg): 1.4
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