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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging - Xing-Chang Wei

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

By: Xing-Chang Wei

eText | 19 September 2017 | Edition Number 1

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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems.

This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.

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You Can Find This eBook In

Non-FictionComputing & I.T.Computer ScienceEngineering & TechnologyElectronics & Communications EngineeringElectronics EngineeringElectronic Devices & MaterialsMicroprocessorsCircuits & ComponentsMicrowave TechnologyScienceScience in General
Energy Technology & EngineeringElectrical Engineering

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Published: 30th June 2020

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