| Preface | p. ix |
| Synthesis, Properties and Bulk Characterization | |
| Poly(amic acid)s and their ionic salt solutions: Synthesis, characterization and stability study | p. 3 |
| A new interpretation of the kinetic model for the imidization reaction of PMDA-ODA and BPDA-PDA poly(amic acid)s | p. 37 |
| Synthesis and characterization of new organosoluble poly(ether imide)s derived from various novel bis(ether anhydride)s | p. 47 |
| Synthesis of novel polyimides from dianhydrides with flexible side chains | p. 71 |
| Polyimides based on rhenium(I) diimine complexes | p. 91 |
| New highly phenylated bis(phthalic) and bis(naphthalic) anhydrides and polyimides therefrom | p. 99 |
| New photoalignable polyimides and their ability to control liquid-crystal alignment | p. 113 |
| Proton conducting polyimides from novel sulfonated diamines | p. 137 |
| High-modulus poly(p-phenylenepyromellitimide) films obtained using a novel gel-drawing technique | p. 155 |
| Effect of structure on the thermal behaviour of bisitaconimide resins | p. 165 |
| 1-Amino-4,5-8-naphthalenetricarboxylic acid-1,8-lactam-4,5-imide-containing macrocycles: Synthesis, molecular modeling and polymerization | p. 185 |
| Synthesis of aromatic benzoxazole polymers for high T[subscript g], low dielectric properties | p. 205 |
| Polybenzobisthiazoles - Critical issues in their performance and properties | p. 225 |
| Electrical breakdown and electrostatic phenomena in ultra-thin polyimide Langmuir-Blodgett films | p. 241 |
| Humid ageing of polyetherimide: Chemical and physical interactions with water | p. 255 |
| Transport of water in high T[subscript g] polymers: A comparison between interacting and non-interacting systems | p. 267 |
| Surface Modification, Interfacial or Adhesion Aspects and Applications | |
| New developments in the adhesion promotion of electroless Ni or Cu films to polyimide substrates | p. 289 |
| Surface modification of polyimide to improve its adhesion to deposited copper layer | p. 315 |
| Study on the structure and adhesion of copper thin films on chemically modified polyimide surfaces | p. 331 |
| Chemical interaction of Fe, Ni and Au with poly(vinyl chloride) and poly(tetrafluoroethylene) during thermal evaporation and the effect of post-metallization X-ray irradiation studied by in situ X-ray photoelectron spectroscopy | p. 345 |
| Plasma polymer adhesion promoters for metal-polymer systems | p. 359 |
| Metallized polyimide films with high reflectivity and electroconductivity | p. 389 |
| RF plasma etching of a polyimide film with oxygen mixed with nitrogen trifluoride | p. 407 |
| Comparison of polyimide film surface properties exposed to real and simulated space environments: Relevance of atomic oxygen effects to wettability in space | p. 419 |
| Development and optimization of a laser carbonized polyimide film as a sensor substrate for an all-polymer humidity sensor | p. 437 |
| Fluorinated copolyimides for microelectronics applications | p. 447 |
| Fabrication of thin-film transistors on polyimide films | p. 459 |
| Polyimide/polystyrene nanocomposite films as membranes for gas separation and precursors for polyimide nanofoams | p. 467 |
| Amine-quinone polyimides--High temperature polymers that protect iron against corrosion | p. 487 |
| Semicrystalline DABP-BTDA polyimide modified by fullerenes for wear protection | p. 499 |
| Influence of aramid fabric on fretting wear performance of polyetherimide composite | p. 511 |
| Semicrystalline polyimides for advanced composites | p. 523 |
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