Reliability, Yield, and Stress Burn-In
A Unified Approach for Microelectronics Systems Manufacturing & Software Development
By: Way Kuo, Kuo Way Kuo, Kary Chien Wei-Ting Kary Chien
Hardcover | 31 January 1998
At a Glance
Hardcover
$264.27
Aims to ship in 7 to 10 business days
ISBN: 9780792381075
ISBN-10: 0792381076
Published: 31st January 1998
Format: Hardcover
Language: English
Number of Pages: 428
Audience: General Adult
Publisher: Springer Nature B.V.
Country of Publication: US
Dimensions (cm): 23.39 x 15.6 x 2.39
Weight (kg): 0.74
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- Non-FictionEngineering & TechnologyMechanical Engineering & MaterialsProduction & Industrial EngineeringComputer Aided Manufacture CAM
- Non-FictionEngineering & TechnologyEnergy Technology & EngineeringElectrical Engineering
- Non-FictionEngineering & TechnologyTechnology in GeneralEngineering in General
- Non-FictionEngineering & TechnologyTechnology in GeneralNanotechnology
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