Semiconductor Manufacturing Technology : Advances Series in Electircal and Computer Engineering - Chue San Yoo

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Semiconductor Manufacturing Technology

By: Chue San Yoo

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Hardcover | 4 March 2008

At a Glance

Hardcover
484 Pages

Dimensions(cm)
23.5 x 16.51 x 2.54

Hardcover

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This textbook contains all the materials that an engineer needs to know to start a career in the semiconductor industry. It also provides readers with essential background information for semiconductor research. It is written by a professional who has been working in the field for over two decades and teaching the material to university students for the past 15 years. It includes process knowledge from raw material preparation to the passivation of chips in a modular format.

Industry Reviews

This book is an excellent resource for the upper-level undergraduate students or for the practicing engineers who aim to be involved in the semiconductor industry. It also provides a very good introduction to the subject for graduate students and researchers. Its value comes from the fact that the author has been deeply involved both in the semiconductor process technology, research or manufacturing and in teaching the semiconductor processing at university level. -- Iasi Polytechnic Magazine "Iasi Polytechnic Magazine"

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You Can Find This Book In

Non-Fiction Engineering & Technology Electronics & Communications Engineering Electronics Engineering Electronic Devices & Materials Semi-Conductors & Super-Conductors Energy Technology & Engineering Electrical Engineering Industrial Chemistry & Manufacturing Technologies Booktopia Publisher Services World Scientific Publishing

Preface	p. v
Acknowledgments	p. vii
Overview	p. 1
Classification of Materials	p. 1
Evolution of Integrated Circuit (IC) Industry	p. 4
From Design to Chips	p. 8
The Wafer Substrate Manufacturing Flow	p. 12
Wafer Processing Flow	p. 19
What Is the Semiconductor Industry Trying to Achieve?	p. 26
The Never-Ending Effort - Yield Improvement	p. 31
Building Blocks for Integrated Circuits	p. 38
Fundamental Semiconductor Concepts	p. 38
Resistors	p. 47
The pn Junctions	p. 50
Capacitors	p. 52
The MOS Transistor	p. 55
Integrated Circuits	p. 58
Thermal Oxidation	p. 63
Introduction	p. 63
Oxidation Mechanism and Modeling	p. 68
Isolation Technology	p. 78
Gate Oxide	p. 86
Cleaning before Thermal Oxidation	p. 91
Gas Kinetics and Plasma Physics	p. 97
Gas Kinetics and Ideal Gases	p. 97
What Is Plasma? How Is It Formed?	p. 104
Introduction to Plasma Physics	p. 110
Electron Impact Phenomena	p. 114
Fundamental Plasma Reactor Configurations	p. 120
Magnetic Field Confinement	p. 124
Chemical Vapor Deposition	p. 128
Classification of CVD Reactors and Films	p. 128
CVD Reactor Design Concepts	p. 133
CVD Reactor Modeling	p. 136
Characterization of Thin Films	p. 146
Applications of CVD Films	p. 153
Plasma-Enhanced Chemical Vapor Deposition and Etching	p. 168
The Plasma Reaction Pathways and System Variables	p. 168
Introduction to PECVD and Film Characterization	p. 174
Applications of PECVD Films	p. 178
Introduction to Plasma Etching	p. 185
Applications of Plasma Etching	p. 190
Plasma-Enhanced CVD and Etching Reactor Modeling	p. 205
Pattern Transfer: Photolithography	p. 212
Introduction	p. 212
Preexposure Steps	p. 214
Resist Chemistry	p. 222
Fundamentals of Image Formation	p. 233
The Exposure System Evolution and Photoprocess Variations	p. 250
Postexposure Steps	p. 258
Pattern Generation	p. 260
Introduction	p. 260
Electron Beam Writing and Resists	p. 267
Back-End Processing for Mask Making	p. 277
Resolution Enhancement Technology	p. 289
Doping Technology	p. 304
Introduction	p. 304
Dopant Diffusion	p. 310
Ion Implantation	p. 317
Implant Damages and Annealing	p. 327
Applications of Doping Technology	p. 332
Metallization and Silicidation	p. 338
Introduction	p. 338
Sputtering Systems	p. 346
Aluminum Metal System	p. 349
Meeting the Step Coverage Requirements	p. 357
Why Silicides?	p. 367
Planarization and CMP Technology	p. 378
Introduction	p. 378
Interlayer Dielectrics	p. 382
Spin on Glass	p. 389
Intermetal Dielectrics	p. 392
Introduction to Chemical Mechanical Polishing and Its Applications	p. 398
CMP Modeling	p. 409
Copper and Low-k	p. 411
Back-End Processes	p. 411
Cu Wiring	p. 415
Low-k Dielectrics	p. 431
Integration of Copper and Low-k Materials	p. 435
Glossary	p. 440
References	p. 453
Index	p. 465
Table of Contents provided by Ingram. All Rights Reserved.

Semiconductor Manufacturing Technology

At a Glance

Hardcover

Industry Reviews

Shipping

How to return your order

Defective items

You Can Find This Book In

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