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Thermal Management of Electronic Systems : Proceedings of the Eurotherm Seminar 29, 14-16 June 1993, Delft, The Netherlands

Proceedings of the Eurotherm Seminar 29, 14-16 June 1993, Delft, The Netherlands

By: C.J. Hoogendoorn (Editor), R.A.W.M. Henkes (Editor), C.J.M. Lasance (Editor)

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Hardcover | 1 April 1994

At a Glance

Hardcover
352 Pages

Dimensions(cm)
23.39 x 15.6 x 2.06

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This volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognized as an important factor in current design methodology. The topics covered include thermal management in general, thermally induced failure, numerical and experimental analysis of systems at various packaging levels, channels and electronic components, measurement techniques, liquid cooling, thermal characterization, thermal stress and die attach defects. For research and development engineers and scientists whose work involves the design and manufacture of electronic systems.

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You Can Find This Book In

Non-Fiction Engineering & Technology Electronics & Communications Engineering Electronics Engineering Mechanical Engineering & Materials Materials Science Mechanics of Solids Engineering Thermodynamics Mathematics Applied Mathematics Mechanical Engineering Energy Technology & Engineering

Electrical Engineering Science Physics Thermodynamics & Heat

Preface
Acknowledgements
Thermal management of air-cooled electronic systems: New challenges for research	p. 3
Analysis and prevention of thermally induced failures in electronic equipment	p. 25
Computational analysis of air and heat flow in electronic systems	p. 45
Thermal analysis of a telecommunications rack system	p. 55
Supporting experiments for CFD based thermal design of telecommunication equipment	p. 65
Two complementary approaches for the thermal simulation of electronic equipment	p. 75
Some considerations on practical formulas used for thermal design of natural ventilated enclosures	p. 85
Natural convection in a rectangular enclosure with an array of chips mounted on a vertical wall	p. 97
Differences between 2D and 3D models predictions in a channel with a dissipating obstacle	p. 107
Effect of radiation on natural convection in tilted channels	p. 117
Thermal study of a laser diode using a finite element method associated with a meshing superimposition method	p. 129
Computer-aided optimization of electrothermal CMOS-compatible infrared sensors	p. 139
Mixed convection and heat transfer on vertical parallel printed circuit boards	p. 149
A parametric study of heat spreading through multiple layer substrates	p. 159
Thermal drift effects in power microwave hybrid circuits	p. 169
Computational modelling of wafer cooldown in a staging module	p. 179
Recent innovations in thermal technology instrumentation applied to materials used in electronic applications	p. 191
An experimental method to determine the effective thermal conductivity of printed circuit boards	p. 201
Air velocity and temperature measurements around a naturally convecting rectangular fin array	p. 211
Application and performance of Si-microcooling systems for electronic devices	p. 223
Temperature controlled measurements of the critical heat flux on micro-electronic heat sources in natural convection and jet impingement cooling	p. 233
Pool boiling heat transfer of dielectric fluids for immersion electronic cooling: effects of pressure	p. 243
Thermal design of a 419 pins ceramic Pin Grid Array package	p. 257
Design of an optimal heat-sink geometry for forced convection air cooling of multi-chip modules	p. 267
Thermal characterization and design for high performance multichip module type laminate	p. 277
The thermal characteristics of a board-mounted 160 lead plastic quad flat pack	p. 287
Investigation of die attach integrity using transient thermal analysis techniques	p. 297
Thermal stress in convectively-cooled plastic-encapsulated chip packages	p. 309
Impact of die attach defects on internal temperature of power hybrids	p. 325
Author Index	p. 335
Table of Contents provided by Blackwell. All Rights Reserved.

Thermal Management of Electronic Systems : Proceedings of the Eurotherm Seminar 29, 14-16 June 1993, Delft, The Netherlands

Proceedings of the Eurotherm Seminar 29, 14-16 June 1993, Delft, The Netherlands

At a Glance

Hardcover

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