Through Silicon Vias

Name: Through Silicon Vias
Brand: Taylor & Francis Inc
Price: 359.75 AUD
Availability: BackOrder

Materials, Models, Design, and Performance

By: Brajesh Kumar Kaushik, Vobulapuram Ramesh Kumar, Manoj Kumar Majumder, Arsalan Alam

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Hardcover | 26 August 2016 | Edition Number 1

At a Glance

Hardcover
216 Pages

Dimensions(cm)
23.4 x 15.6 x 1.8

Hardcover

RRP $420.00

$359.75

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Available for Backorder. We will order this from our supplier however there isn't a current ETA.

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

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